There are many kinds of solder ball arrangement in BGA package, which can be divided into staggered type, full array type, and peripheral type. According to the package form can be divided into TBGA, CBGA, FCBGA, and PBGA. How to choose a suitable BGA package according to the chip requirements? The following are some ideas sorted out by Jinyu Semiconductor:

Number and arrangement of pins

BGA packages are available in a variety of sizes, ranging from dozens to thousands of pins. Therefore, it is first necessary to determine the number of pins required and ensure that the package selected can meet this requirement. The number of pins in a BGA package can range from dozens to thousands. Common pin numbers include 25, 49, 64, 100, 144, 256, 400, 676, and so on. The number of pins directly affects the size and complexity of the package.

In addition, it is also necessary to pay attention to the arrangement of the pins, the arrangement of the mesh array determines the shape and layout of the BGA package. The most common arrangement is a grid of squares or rectangles, but there are other forms of arrangement, such as rings or irregular shapes.

Power consumption and heat dissipation requirements

According to the power consumption and heat dissipation requirements of the chip, the BGA package with good heat dissipation performance is selected. Chips with high power consumption usually require better cooling solutions. For example, when choosing a BGA package, you can consider a larger package size, but the size specifications of the BGA package usually follow some industry standards, such as JEDEC (Joint Electronic Equipment Engineering Council) issued specifications. These specifications define various sizing options to ensure the interchangeability and compatibility of BGA packages.

Or use a metal cover package to provide more cooling surface area or increase the cooling layer.

PCB design limitations

Because different pin arrangements provide different pin layouts and connections, PCB design limitations need to be considered when selecting BGA packages. This includes board spacing, line width and layout requirements with other components, to ensure that the selected BGA package is consistent with the PCB design specification, so that the selected package size can be adapted to and connected to the PCB, and can accommodate the required number of pins and sizes in the physical layout, which is also something to be taken into account in every link of the chip design.

Cost and reliability requirements

Cost and reliability are factors that need to be considered when selecting the right BGA package. In general, BGA packages with high pin numbers, more complex package structures and better heat dissipation performance will be more expensive, while smaller packages may have some impact on mechanical strength and heat dissipation performance, such as the metal cover package mentioned above.

Due to the relatively high cost of metal packaging, it is also necessary to measure the necessity of its application scenarios for this cost expenditure, for example, for applications in high vibration or high temperature environments, it is necessary to choose BGA packaging with better mechanical strength and heat resistance.