For decades, chip packaging technology has been following the development of IC development, in order to cope with the strict requirements of packaging and the rapid increase in the number of I/O pins, resulting in increased power consumption, in the 1990s, BGA(ball grid array or welding ball array) packaging should be delivered.

What are the advantages of BGA packaging? What is the difference between other packaging methods?

1) Pin layout and density

Traditional pin packages (such as DIP, SOP, etc.) usually arrange the pins of the chip on either side or around the package. The BGA package distributes the pins of the chip throughout the bottom and connects them with spherical solder joints. This layout allows the BGA package to achieve a higher pin density, which can reduce the volume to one-third without changing the memory capacity. This makes it suitable for high-performance chips that require a large number of pins, such as processors and graphics chips.

2) Manufacturing process

Traditional pin package manufacturing processes often require manual pin alignment and welding operations, which are time-consuming and error-prone. In contrast, manufacturing is usually done with automated equipment that does not require manual pin alignment and welding. This makes the BGA packaging manufacturing process more efficient and reliable, and reduces manufacturing costs.

3) Heat dissipation performance

Traditional pin packages usually have no special thermal design. BGA packages tend to have metal bottoms, and their larger contact area helps to conduct heat better. In addition, by connecting the chip and the substrate with the welding ball, a strong heat conduction path can be formed, so that the heat generated in the chip can be more effectively dissipated to the external environment. Therefore, compared with other packaging methods, BGA packaging is better in terms of heat dissipation performance.

4) Signal transmission and interference

In a traditional pin package, the pins are connected between the chip and the substrate by long, narrow wires. Such a connection is susceptible to signal noise and crosstalk. In contrast, the BGA package connects the chip and substrate through the welding ball, and the signal transmission path is shorter and more stable, effectively reducing the risk of signal interference and providing more reliable signal transmission.

5) Mechanical stability

Because the BGA package uses a solder ball to secure the chip to the substrate, it has lower mechanical displacement and higher impact resistance. Compared to traditional pin packages, BGA packages are more reliable in devices that need to be moved frequently or are subject to mechanical vibration, such as laptops, smartphones, etc.

Because of its superior performance, BGA package is especially suitable for chips with high integration and high power consumption, such as high-performance integrated circuits such as microprocessors and graphics chips, so it is widely used in communication equipment, computers, automotive electronics, consumer electronics, industrial control and instrument equipment and other fields.

The above is a roundup of the advantages of BGA and the differences from other packages. If you have different ideas, please leave them in the comments section